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Die bonding Stamping Pin D/B

Production Information
Epoxy Stamping Tools      
        
Die bonding Stamping Pin, more precise than common dispensing pin or tip, glue the electronic component  solder or adhesive in precision position.The adhesivemust
be placed in an appropriate amount at each attachment position while avoiding excessive solder paste on the PCBor IC.
This is a high-speed precision repeatability process.


Material: 
• Ceramic
• High Speed Steel(HSS)

Application: 
• ASM Bonding Machine
• IC
• Assembly
• LED

Features/Benefits:
• Saving consumables
• High mobility
• High and low viscosity glue corresponding
• Precise and labor saving